https://www.ams-electronics.co.uk/wp-content/uploads/2020/02/OM-338-PT-CNP-TB-SM893-ENGLISH.pdf
Very high quality flux for BGA reballing and repair. We recommend this flux for all GPU and motherboard socket BGA packages. Activates, wets and evaporates perfectly for the application. Example: https://youtu.be/mGVR4cpGtfU?si=9CJNvc70xj6oZErX&t=994
ALPHA® OM-338-PT Fine Feature, Zero Halogen, Lead-Free Flux
1. Refrigerate to guarantee stability @ (1-10)C, (32-50)F 2. Shelf life of refrigerated paste is 6 months from the manufacturing date. 3. Paste can be stored for 2 weeks at room temperatures up to 25oC (77F) prior to use. 4. When refrigerated, warm-up of paste container to room temperature for up to 4 hrs. Paste must be 19C (66F) before processing. Verify paste temperature with a thermometer to ensure paste is at 19C (66F) or greater before setup. 5. Do not remove worked paste from stencil and mix with unused paste in jar. This will alter rheology of unused paste. 6. These are starting recommendations and all process settings should be reviewed independently. 7.Temperature working range (on the stencil): 19°C – 32°C